Semiconductor memory device and operation method thereof

ABSTRACT

A semiconductor memory device according to an embodiment includes a control circuit configured to apply a first voltage to a selected first line, apply a second voltage to a selected second line, and apply a third voltage and a fourth voltage to a non-selected first line and a non-selected second line in a setting operation, respectively. The control circuit includes a detection circuit configured to detect a transition of a resistance state of a selected memory cell using a reference voltage. The control circuit is configured to execute a read operation in which the control circuit applies the third voltage to the selected first line and the non-selected first line, applies the second voltage to the selected second line, and applies the fourth voltage to the non-selected second line, and set the reference voltage based on a voltage value of the selected second line.

CROSS REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority fromprior Japanese Patent Application No. 2012-173302, filed on Aug. 3,2012, the entire contents of which are incorporated herein by reference.

BACKGROUND

1. Field

Embodiments described in the present specification relate to asemiconductor memory device configured as an arrangement of memory cellseach storing data by a change in resistance value of a variableresistance element, and an operation method thereof.

2. Description of the Related Art

In recent years, a resistance varying memory device employing a variableresistance element as a storage element has been receiving attention asa successor candidate of flash memory. Now, it is assumed that theresistance varying memory device, as well as including a resistancevarying memory in a narrow sense, that is, a resistance varying memorythat configures a transition metal oxide as a recording layer and storesa resistance value state of the transition metal oxide in a nonvolatilemanner (ReRAM: Resistive RAM), includes also a phase change memory thatemploys chalcogenide or the like as a recording layer and usesresistance value information of a crystalline state (conductor) and anamorphous state (insulator) of the chalcogenide or the like (PCRAM:Phase Change RAM), and so on.

A memory cell array in a resistance varying memory device has memorycells disposed at intersections of bit lines and word lines, each memorycell being configured from a variable resistance element and a currentrectifier element such as a diode or the like. In such a memory cellarray, selection of a memory cell can be performed using the currentrectifier element such as a diode or the like. Moreover, it is alsopossible for a high-density memory cell array to be realized byalternately stacking the bit lines and word lines to configure athree-dimensional stacked arrangement of memory cell arrays.

A resistance state of a recording layer in a resistance varying memoryis changed by applying a voltage/current to the recording layer.Therefore, during a write operation, unless it is quickly detected thatthe resistance state of the recording layer has changed and thevoltage/current application discontinued, an excessive electrical stressis applied to the recording layer, whereby a functional decline of therecording layer occurs. Accordingly, when a write operation is executedon a memory cell to change the resistance state, it must be quicklydetected that the resistance state of the variable resistance element inthe memory cell has changed, and thereby avoid, as far as possible,application of an unnecessary operational voltage. Detection of a changein resistance value of the variable resistance element is performed by,for example, detecting a voltage value of the bit line connected to thememory cell. Preparing a certain reference voltage and detecting whenthere is a reversal in magnitudes of the voltage value of the bit lineconnected to the memory cell and the voltage value of the referencevoltage allows the change in resistance value of the memory cell to bedetected.

In a memory cell array having memory cells arranged at intersections ofbit lines and word lines, when a write operation is executed on aselected memory cell, the voltage state of the selected bit line and theselected word line change according to a resistance state ofnon-selected memory cells surrounding the selected memory cell. In viewof the change in voltage state of the selected bit line and the selectedword line, the reference voltage must be designed with a considerablemargin. This makes it difficult to set the reference voltage employedfor detecting whether the resistance state of the selected memory cellhas undergone transition or not. There is also a possibility that, inthe case where the voltage value of the reference voltage deviates fromthe voltage of the bit line connected to the selected memory cell arounda time of the operation, the change in resistance state cannot beaccurately detected. As a result, an excessive voltage is applied to theselected memory cell resulting in the memory cell being destroyed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is one example of a block diagram of a semiconductor memorydevice according to a first embodiment of the present invention.

FIG. 2 is one example of a perspective view of part of a memory cellarray 1.

FIG. 3 is one example of a cross-sectional view taken along the lineI-I′ and looking in the direction of the arrows in FIG. 2, showing asingle memory cell portion.

FIG. 4 is one example of a circuit diagram of the memory cell array 1and a peripheral circuit of the memory cell array 1.

FIG. 5 is one example of a perspective view of part of a memory cellarray 1 in a separate example of configuration.

FIG. 6 is one example of a cross-sectional view taken along the lineII-II′ and looking in the direction of the arrows in FIG. 5.

FIG. 7 is one example of a view showing a voltage application stateduring a setting operation in the first embodiment.

FIG. 8 is one example of a diagram of voltage waveforms during thesetting operation of the present embodiment.

FIG. 9 is one example of a view showing a voltage application stateduring the setting operation in the first embodiment.

FIG. 10 is one example of a view showing a voltage application stateduring the setting operation in the first embodiment.

FIG. 11 is one example of a view showing a voltage application stateduring a pre-read operation in the first embodiment.

FIG. 12 is one example of a view describing a control circuit in thefirst embodiment.

FIG. 13 is one example of a flowchart describing operations in a secondembodiment.

FIG. 14 is one example of a view showing a selected memory cell during asetting operation in the second embodiment.

FIG. 15 is one example of a flowchart describing operations in a thirdembodiment.

FIG. 16 is one example of a view showing a selected memory cell during asetting operation in the third embodiment.

DETAILED DESCRIPTION

A semiconductor memory device according to an embodiment comprises: amemory cell array including a plurality of first lines disposed on asubstrate, a plurality of second lines disposed intersecting the firstlines, and memory cells disposed at each of intersections of the firstlines and the second lines and each configured having a currentrectifier element and a variable resistance element connected in seriestherein; and a control circuit configured to apply a first voltage to aselected first line, apply a second voltage having a voltage value whichis smaller than that of the first voltage to a selected second line, andapply a third voltage and a fourth voltage to a non-selected first lineand a non-selected second line in a setting operation, respectively,such that a first potential difference is applied to a selected memorycell disposed at the intersection of the selected first line and theselected second line. The control circuit includes a detection circuitconfigured to, during the setting operation, detect a transition of aresistance state of the selected memory cell using a reference voltage.The control circuit is configured to, before the setting operation,execute a read operation in which the control circuit applies the thirdvoltage to the selected first line and the non-selected first line,applies the second voltage to the selected second line, and applies thefourth voltage to the non-selected second line, and set the referencevoltage based on a voltage value of the selected second line during theread operation.

Next, embodiments of the present invention are described in detail withreference to the drawings. Note that in the descriptions of the drawingsin the embodiments below, identical symbols are assigned to placeshaving an identical configuration, and duplicated descriptions of suchplaces are omitted.

[Overall Configuration]

FIG. 1 is one example of a block diagram showing a configuration of anonvolatile memory according to a first embodiment of the presentinvention. This nonvolatile memory comprises a memory cell array 1having memory cells disposed in a matrix therein, each of the memorycells using a variable resistance element VR to be described later.

A column control circuit 2 is electrically connected to a bit line BL ofthe memory cell array 1 in order to select the bit line BL of the memorycell array 1 and perform data erase of the memory cell, data write tothe memory cell, and data read from the memory cell for the sake ofcontrolling a voltage of the bit line BL. Moreover, a row controlcircuit 3 is electrically connected to a word line WL of the memory cellarray 1 in order to select the word line WL of the memory cell array 1and perform data erase of the memory cell, data write to the memorycell, and data read from the memory cell for the sake of controlling avoltage of the word line WL.

[Memory Cell Array 1]

FIG. 2 is one example of a perspective view of part of the memory cellarray 1, and FIG. 3 is one example of a cross-sectional view taken alongthe line I-I′ and looking in the direction of the arrows in FIG. 2,showing a single memory cell portion. Word lines WL0˜WL2 acting as aplurality of first lines are arranged in a Y direction parallel to asurface of a semiconductor substrate S. Bit lines BL0˜BL2 acting as aplurality of second lines are arranged in an X direction parallel to thesurface of the semiconductor substrate S so as to intersect the wordlines WL. A memory cell MC is disposed at each of intersections of theword lines WL0˜WL2 and the bit lines BL0˜BL2 so as to be sandwiched byboth lines. The first and second lines are preferably of a materialwhich is heat-resistant and has a low resistance value. For example, W,WN, WSi, NiSi, CoSi, and so on, maybe employed as the material.

[Memory Cell MC]

As shown in FIG. 3, the memory cell MC is a circuit having a variableresistance element VR and a current rectifier element, for example, adiode DI, or the like, connected in series in a Z directionperpendicular to the semiconductor substrate S. Disposed above and belowthe variable resistance element VR and the diode DI are electrodes EL1,EL2, and EL3 functioning as a barrier metal and an adhesive layer. Thediode DI is disposed on the electrode EL1, and the electrode EL2 isdisposed on the diode DI. The variable resistance element VR is disposedon the electrode EL2, and the electrode EL3 is disposed on the variableresistance element VR. Employable as an electrode material of theelectrodes EL1, EL2, and EL3 is, for example, titanium nitride (TiN).Moreover, it is also possible for a different material to be adopted foreach of the materials of the electrodes EL1, EL2, and EL3. For example,the following may also be employed as the material of the electrodes,namely Pt, Au, Ag, TiAlN, SrRuO, Ru, RuN, Ir, Co, Ti, TaN, LaNiO, Al,PtIrO_(x), PtRhO_(x), Rh, TaAlN, W, WN, TaSiN, TaSi₂, TiSi, TiC, TaC,Nb—TiO₂, NiSi, CoSi, conductive silicon including an impurity, and soon. Moreover, insertion of a metal film to make orientation uniform isalso possible. Moreover, inserting a separate buffer layer, barriermetal layer, adhesive layer, and so on, is also possible. Furthermore, astructure that changes an order in the Z direction of the diode DI andthe variable resistance element VR is also included in embodiments ofthe present invention.

[Variable Resistance Element]

Employed as the variable resistance element VR is a substance capable ofhaving its resistance value changed via an electric field, a current,heat, chemical energy, and so on, by application of a voltage. Forexample, the variable resistance element VR may employ a metal oxide,such as hafnium oxide (HfO_(x)), manganese oxide (MnO₂), titanium oxide(TiO_(x)), niobium oxide (NbO_(x)), aluminum oxide (AlO_(x)), nickeloxide (NiO), tantalum oxide (TaOx), or tungsten oxide (WO).

[Current Rectifier Element]

The current rectifier element employed in the memory cell MC is notspecifically limited regarding a material, structure and so on, providedit is an element having a current rectifying characteristic in itscurrent-voltage characteristics. One example of the current rectifierelement is a diode DI manufactured by polysilicon (Poly-Si). Employableas the diode DI is, for example, a PIN diode having a p-type layer andan n-type layer that include impurities, and an i layer inserted betweenthese p-type and n-type layers that does not include an impurity.Moreover, the following may also be employed as the diode DI, namely aPN junction diode comprising a p-type layer and an n-type layer, variouskinds of diodes such as a Schottky diode, a punch-through diode, and soon.

[Memory Cell Array and its Peripheral Circuits]

FIG. 4 is one example of a circuit diagram of the memory cell array 1and its peripheral circuits. In FIG. 4, the memory cell MC is configuredby the variable resistance element VR and the diode DI. The diode DI hasa current rectifying characteristic such that current flows through aselected memory cell MC from a selected bit line BL to a selected wordline WL. One end of each of the bit lines BL is connected to acolumn-system peripheral circuit 2 a which is part of the column controlcircuit 2. In addition, one end of each of the word lines WL isconnected to a row-system peripheral circuit 3 a which is part of therow control circuit 3. Voltages required in operations on the bit linesBL and the word lines WL are supplied by these column-system peripheralcircuit 2 a and row-system peripheral circuit 3 a. The column-systemperipheral circuit 2 a and the row-system peripheral circuit 3 a mayeach be appended with a different function required in operationalcontrol of the bit lines BL and the word lines WL.

[Example of Stacked Memory Cell Array]

As shown in FIG. 5, a three-dimensional structure having theabove-described memory cell structure stacked multiply in the Zdirection may also be adopted. FIG. 6 is one example of across-sectional view showing the II-II′ cross-section in FIG. 5. Theexample illustrated is a memory cell array having a four-layer structureconfigured from cell array layers MA0˜MA3. A word line WL0 j is sharedby the memory cell MC in the cell array layers MA0 and MA1 below andabove the word line WL0 j, a bit line BL1 i is shared by the memory cellMC in the cell array layers MA1 and MA2 below and above the bit line BL1i, and a word line WL1 j is shared by the memory cell MC in the cellarray layers MA2 and MA3 below and above the word line WL1 j. Note thatthe previously mentioned column control circuit 2 and row controlcircuit 3 may be provided to each of the cell array layers MA or may beshared by the cell array layers MA.

[Setting Operation]

One example of operations according to the present embodiment aredescribed below with reference to FIGS. 7 and 8. Write of data to thememory cell MC is performed by applying a certain voltage to thevariable resistance element VR of the selected memory cell MC for acertain time. As a result, the variable resistance element VR of theselected memory cell MC changes from a high-resistance state to alow-resistance state. This operation for changing the variableresistance element VR from a high-resistance state to a low-resistancestate is referred to below as a setting operation. Now, the settingoperation in the present embodiment is assumed to be an operation forchanging the variable resistance element VR from a high-resistance stateto a low-resistance state by applying a setting voltage in a directionopposite to a current rectifying direction of the diode DI. The settingoperation for changing the variable resistance element VR from ahigh-resistance state to a low-resistance state by applying a settingvoltage in a direction opposite to a current rectifying direction of thediode DI is described below.

FIG. 7 is a view showing a voltage application state during the settingoperation of the present embodiment. FIG. 7 shows the voltageapplication state when the setting operation is executed on asingle-layer memory cell array 1. FIG. 8 is a diagram of voltagewaveforms during the setting operation of the present embodiment.

As shown in FIG. 8, in the setting operation of the present embodiment,a voltage Vnbl is applied to all the non-selected bit lines BL0, BL2,BL3. A voltage Vnwl is applied to all the non-selected word lines WL0,WL2, WL3. In addition, when the setting operation starts, a voltage Vblis applied to the selected bit line BL1.

Next, at time t1, a voltage Vwl is applied to the selected word lineWL1. Note that the voltage Vwl is a voltage having a certain positivevoltage value. This results in a voltage Vwl-Vbl being applied to theselected memory cell MC11 connected to the selected bit line BL1 and theselected word line WL1 in an opposite direction to the currentrectifying direction of the diode DI. In reality, there is a voltagedrop in wiring lines and driver portions, but for simplicity,description proceeds here assuming there is no such voltage drop. Now,the voltage Vnbl and the voltage Vnwl are set to voltages of a degreeappropriate to prevent false operation occurring in the non-selectedmemory cells MC. The voltage Vnbl and the voltage Vnwl may be identicalvoltages or may be different voltages.

The variable resistance element VR of the selected memory cell MC11changes from a high-resistance state to a low-resistance state due tothe voltage Vwl-Vbl. At that time, current flows from the selected wordline WL1 to the selected bit line BL1 via the low-resistance stateselected memory cell MC11, whereby the selected bit line BL1 rises by anamount of a voltage ΔV. When it is detected that the voltage of theselected bit line BL1 has exceeded a reference voltage VREF, at time t2,application of the voltage Vwl to the selected word line WL1 issuspended. The reference voltage VREF is set for the voltage change ΔVof the selected bit line BL1 to be appropriately detected. Then, voltageapplication to all wiring lines is suspended, whereby the settingoperation is completed. The above description of the setting operationis for the case where voltage drop in the wiring lines and driverportions is negligibly small. However, when voltage drop in the wiringlines and driver portions is large, determination of the referencevoltage VREF is difficult, as will be described later.

[Setting Operation in Stacked Memory Cell Array]

Next, one example of the setting operation on the memory cell array 1provided with a plurality of cell array layers MA is described withreference to FIG. 9. FIG. 9 is a view showing a voltage applicationstate during the setting operation of the present embodiment. In FIG. 9,the memory cell MC configured from the variable resistance element VRand the diode DI is shown by a triangular symbol as illustrated. A baseend side and an apex side of the triangular symbol indicate,respectively, an anode and a cathode, and a direction from the anodetoward the cathode indicates the current rectifying direction of thediode DI.

FIG. 9 shows the cell array layer MA1 and the cell array layer MA2. Thecell array layer MA1 is provided between the word lines WL00, WL01, andWL02 and the bit lines BL10, BL11, and BL12, and the cell array layerMA2 is provided between the bit lines BL10, BL11, and BL12 and the wordlines WL10, WL11, and WL12. In the example shown in FIG. 9, the settingoperation is executed on the memory cell MC11_1 provided in the cellarray layer MA1.

As shown in FIG. 9, during the setting operation, the voltage Vwl isapplied to the selected word line WL01. In addition, the voltage Vbl isapplied to the selected bit line BL11. As a result, in the ideal casewhere voltage drop in the wiring lines and driver portions isnegligible, the voltage Vwl-Vbl is applied to the selected memory cellMC11_1 connected to the selected bit line BL11 and the selected wordline WL01 in an opposite direction to the current rectifying directionof the diode DI. The variable resistance element VR of the selectedmemory cell MC11_1 changes from a high-resistance state to alow-resistance state due to this voltage Vwl-Vbl.

Now, during the setting operation, the voltage Vnbl is applied to all ofthe non-selected bit lines BL10, BL12. The voltage Vnwl is applied thenon-selected word lines WL00, WL02 provided in the cell array layer MA1.A voltage Vnwl′ is applied to the non-selected word lines WL10, WL11,WL12 provided in the cell array layer MA2. The voltage Vnbl, the voltageVnwl, and the voltage Vnwl′ may be identical, or may be different.

Now, during the setting operation on the memory cell array 1 providedwith a plurality of cell array layers MA, a problem caused by theresistance state of the non-selected memory cells MC may occur in theoperation. FIG. 10 is a view graph showing a voltage application stateduring the setting operation when there is a low-resistance statenon-selected memory cell MC. In FIG. 10, the dotted line triangularsymbol denotes the non-selected memory cell MC in the low-resistancestate.

As shown in FIG. 10, during the setting operation, the voltage Vwl isapplied to the selected word line WL01. In addition, the voltage Vbl isapplied to the selected bit line BL11. Moreover, during the settingoperation, the voltage Vnbl is applied to all of the non-selected bitlines BL10, BL12. In addition, the voltage Vnwl is applied to thenon-selected word lines WL00, WL02 provided in the cell array layer MA1.The voltage Vnwl′ is applied to the non-selected word lines WL10, WL11,WL12 provided in the cell array layer MA2.

Now, in the ideal case where voltage drop in the wiring lines and driverport ions is negligible, a voltage Vnwl-Vbl is applied to thenon-selected memory cells MC10_1 and MC12_1 connected between thenon-selected word lines WL00 and WL02 and the selected bit line BL11 inan opposite direction to the current rectifying direction of the diodeDI. Moreover, in the ideal case where voltage drop in the wiring linesand driver portions is negligible, a voltage Vnwl′-Vbl is applied to thenon-selected memory cells MC10_2, MC11_2, and MC12_2 connected betweenthe non-selected word lines WL10, WL11, and WL12 and the selected bitline BL11 in an opposite direction to the current rectifying directionof the diode DI. At this time, a leak current sometimes flows into theselected bit line BL11 via the non-selected memory cells MC10_1, MC12_1,MC10_2, MC11_2, and MC12_2, depending on a resistance state of thevariable resistance element VR in the non-selected memory cells MC10_1,MC12_1, MC10_2, MC11_2, and MC12_2. Ideally, there is preferably no leakcurrent regardless of the resistance state of the variable resistanceelement VR, but in reality, the leak current is anticipated to differaccording to the resistance state of the variable resistance element VR.That is, if the resistance state of the variable resistance element VRlowers, the leak current increases.

For example, when the variable resistance element VR in the non-selectedmemory cells MC10_1, MC12_1, MC10_2, MC11_2, and MC12_2 is in alow-resistance state, the voltage of the selected bit line BL11 risesdue to the leak current flowing via the non-selected memory cellsMC10_1, MC12_1, MC10_2, MC11_2, and MC12_2. During the settingoperation, a voltage change in the selected bit line BL11 based on achange in the resistance state of the selected memory cell MC11_1 isdetected, but if a voltage change due to the leak current occurs, thereis a possibility that the change in the resistance state of the selectedmemory cell MC11_1 cannot be accurately detected. In addition, anoptimum value of the reference voltage VREF also differs according tothe resistance state of the variable resistance element VR in thenon-selected memory cells MC10_1, MC12_1, MC10_2, MC11_2, and MC12_2. Inresponse to these problems, the semiconductor memory device according tothe present embodiment executes a pre-read operation described below.

[Pre-Read Operation]

A pre-read operation according to the present embodiment is describedbelow with reference to FIGS. 11 and 12. FIG. 11 is a view showing avoltage application state during the pre-read operation in the presentembodiment. In addition, FIG. 12 is a view describing a control circuitin the present embodiment.

In the example shown in FIG. 11, the memory cell MC11_1 provided betweenthe bit line BL11 and the word line WL01 is assumed to be selectedduring the latter performed setting operation. The pre-read operation isexecuted prior to the setting operation on this memory cell MC11_1.During the pre-read operation, the voltage Vbl substantially identicalto that applied during the setting operation is applied to the bit lineBL11 which is to become the selected bit line during the later performedsetting operation.

Moreover, as shown in FIG. 11, during the pre-read operation, thevoltage Vnbl substantially identical to that applied during the settingoperation is applied to the bit lines BL10, BL12. The voltage Vnwlsubstantially identical to that applied during the setting operation isapplied to the word lines WL00, WL01, WL02 including the selected wordline WL01. Likewise, the voltage Vnwl′ substantially identical to thatapplied during the setting operation is applied to the word lines WL10,WL11, WL12. The voltage applications during this pre-read operationcause voltages similar to those during the setting operation to beapplied to the memory cells MC other than the memory cell MC11_1 whichis to become the selected memory cell during the later settingoperation.

Next, a configuration of the control circuit shown in FIG. 12, andcontrol of the pre-read operation and the setting operation employingthis control circuit are described. The control circuit shown in FIG. 12is provided in the column control circuit 2 and used in the settingoperation and the pre-read operation, for example. This control circuitcomprises a current supply circuit 11, a voltage detection circuit 12, areference voltage generating circuit 13, a sense amplifier 14, a latchcircuit 15, a control signal transmission circuit 16, and a buffercircuit 17. The current supply circuit 11 supplies a current required inan operation to the bit line BL. The voltage detection circuit 12detects the voltage of the bit line BL by detecting a voltage VNSEN ofanode NSEN. The reference voltage generating circuit 13 generates thereference voltage VREF based on a voltage detection result of thevoltage detection circuit 12. The sense amplifier 14 compares thevoltage VNSEN of the node NSEN and the reference voltage VREF, anddetects transition of the resistance state of the memory cell MC basedon a magnitude relationship of these voltage VNSEN of the node NSEN andreference voltage VREF. The latch circuit 15 retains a detection resultof the sense amplifier 14 temporarily, and sends the detection result tothe control signal transmission circuit 16 or the buffer circuit 17. Thecontrol signal transmission circuit 16 transmits signals I_LOAD andG_GND to the current supply circuit 11 or a transistor N10 to controlstart and finish of an operation. The buffer circuit 17 can retain dataof a voltage value of the bit line BL detected by the voltage detectioncircuit 12.

During the pre-read operation shown in FIG. 11, the voltage of theselected bit line BL11 is detected by the voltage detection circuit 12.As mentioned above, the pre-read operation causes voltages similar tothose during the setting operation to be applied to the memory cells MCother than the memory cell MC11_1 which is to become the selected memorycell during the later setting operation. At this time, the voltagedetection circuit 12 detects the voltage of the bit line BL11, andtransmits that detection result to the reference voltage generatingcircuit 13. During the later performed setting operation, the referencevoltage generating circuit 13 changes the value of the reference voltageVREF based on the voltage value of the bit line BL11 detected during thepre-read operation.

The reference voltage VREF generated by the reference voltage generatingcircuit 13 is set to a value such as to enable a voltage change ΔV ofthe selected bit line BL11 arising from the change in resistance stateof the selected memory cell MC11_1 to be appropriately detected. Forexample, when there is no change in voltage of the bit line BL11 duringthe pre-read operation, the reference voltage VREF may be set to a valuesubstantially identical to the voltage change ΔV of the selected bitline BL11 arising from the change in resistance state of the selectedmemory cell MC11_1 during the setting operation. On the other hand, whenthe bit line BL11 has changed to a voltage Vα during the pre-readoperation, the reference voltage VREF may be set to a valuesubstantially identical to the value that has the voltage Vα added tothe voltage change ΔV of the selected bit line BL11 arising from thechange in resistance state of the selected memory cell MC11_1 during thesetting operation.

Any way of determining the value of the reference voltage VREF isacceptable, provided an appropriate value is set after the changedvoltage Vα of the bit line BL11 during the pre-read operation is takeninto consideration. During the setting operation in the presentembodiment, the sense amplifier 14 detects transition of the resistancestate of the selected memory cell MC, employing the value of thereference voltage VREF determined in such a manner. The detection resultof the resistance state of the selected memory cell MC11_1 is sent tothe control signal transmission circuit 16 via the latch circuit 15. Thecontrol signal transmission circuit 16, in the case of detecting thatthe selected memory cell MC11_1 has changed to a low-resistance state,suspends operation of the current supply circuit 11 by the signal I_LOADand discharges the selected bit line BL11 and the selected word lineWL01 via the transistor N10, thereby finishing the setting operation.

[Advantages]

When a leak current flows in the selected bit line BL from memory cellsMC other than the selected memory cell MC in the pre-read operation, thevoltage of the selected bit line BL changes as a result of the memorycells MC other than the selected memory cell MC also during the settingoperation. During the setting operation, the voltage change in theselected bit line based on the change in resistance state of theselected memory cell MC is detected, but if a voltage change arisingfrom memory cells MC other than the selected memory cell MC occurs,there is a possibility that the change in resistance state of theselected memory cell MC cannot be accurately detected.

To counter this, in the setting operation in the present embodiment, thevalue of the reference voltage VREF is changed based on the voltagevalue of the bit line BL detected during the pre-read operation.Changing the reference voltage VREF in view of the voltage changearising from memory cells MC other than the selected memory cell MCenables the voltage change in the selected bit line BL arising from thechange in resistance state of the selected memory cell MC during thesetting operation to be reliably detected. Therefore, the semiconductormemory device in the pre sent embodiment can reliably detect change inthe resistance state of the selected memory cell MC.

If an excessive voltage is applied to the variable resistance element VRemployed in the memory cell MC, there is a risk of the variableresistance element VR being destroyed. However, setting the value of thereference voltage VREF based on the pre-read operation enables it to beappropriately detected that the resistance state of the variableresistance element VR has changed and thereby finish the operation. As aresult, an excessive voltage is not applied to the variable resistanceelement VR employed in the memory cell MC, whereby destruction of thevariable resistance element VR can be prevented.

Second Embodiment

Next, a second embodiment of the present invention is described withreference to FIGS. 13 and 14. An overall configuration of thesemiconductor memory device in the present embodiment is similar to thatin the first embodiment, hence a detailed description of the overallconfiguration is omitted. Moreover, places having configurations similarto those in the first embodiment are assigned with symbols identical tothose assigned in the first embodiment and a duplicated description ofsuch places is omitted. The above-described first embodiment describedthe setting operation and pre-read operation when there was one selectedmemory cell MC. The second embodiment below describes a procedure whenexecuting the setting operation and pre-read operation on a plurality ofselected memory cells MC.

[Operations in Present Embodiment]

FIG. 13 is one example of a flowchart describing a procedure whenperforming a pre-read operation and a setting operation in the presentembodiment. FIG. 14 is one example of a view showing a selected memorycell during the setting operation in the present embodiment.

As shown in FIG. 14, the setting operation in the present embodiment isexecuted on the memory cells MC10_1, MC11_1, and MC12_1 connected to theselected bit line BL11. At this time, the pre-read operation and thesetting operation are executed on each of the selected memory cells MCon an individual basis. Description proceeds below with reference to theflowchart of FIG. 13.

When operation of the semiconductor memory device in the presentembodiment is started, in step S11, the pre-read operation on the bitline BL11 is executed. This pre-read operation is similar to thepre-read operation in the first embodiment described using FIG. 11.Next, in step S12, the setting operation on the selected memory cellMC10_1 is executed. At this time, the voltage Vwl is applied to theselected word line WL00 and the voltage Vbl is applied to the selectedbit line BL11. Due to the voltage Vwl-Vbl, the variable resistanceelement VR in the selected memory cell MC10_changes from ahigh-resistance state to a low-resistance state and the voltage of theselected bit line BL11 rises. If it is detected that the voltage of theselected bit line BL11 has exceeded the reference voltage VREF, thesetting operation finishes. Now, the reference voltage VREF is set basedon the pre-read operation on the bit line BL11 executed immediatelybefore.

Thereafter, in step S13, the pre-read operation on the bit line BL11 isexecuted, and in step S14, the setting operation on the selected memorycell MC11_1 is executed. When it is detected that the voltage of theselected bit line BL11 has exceeded the reference voltage VREF, thesetting operation finishes. Similarly, in step S15, the pre-readoperation on the bit line BL11 is executed, and in step S16, the settingoperation on the selected memory cell MC12_1 is executed. When it isdetected that the voltage of the selected bit line BL11 has exceeded thereference voltage VREF, the setting operation finishes. The referencevoltage VREF during the setting operations on the selected memory cellsMC11_1 and MC12_1 is set based on the pre-read operation on the bit lineBL11 executed immediately before each of the setting operations.

[Advantages]

In the setting operation in the present embodiment, the value of thereference voltage VREF is changed based on the voltage value of the bitline BL detected during the pre-read operation. Changing the referencevoltage VREF in view of the voltage change arising from memory cells MCother than the selected memory cell MC enables the voltage change in theselected bit line BL arising from the change in resistance state of theselected memory cell MC during the setting operation to be reliablydetected. Therefore, the semiconductor memory device in the presentembodiment can reliably detect change in the resistance state of theselected memory cell MC.

Moreover, in the procedure of the setting operation and the pre-readoperation in the present embodiment, a pre-read operation is performedbefore the setting operation is executed, on each of the selected memorycells MC. This enables an appropriate reference voltage VREF to be setfor each of the selected memory cells MC, thereby reducing thepossibility of an erroneous in an operation.

Third Embodiment

Next, a third embodiment of the present invention is described withreference to FIGS. 15 and 16. An overall configuration of thesemiconductor memory device in the present embodiment is similar to thatin the first embodiment, hence a detailed description of the overallconfiguration is omitted. Moreover, places having configurations similarto those in the first embodiment are assigned with symbols identical tothose assigned in the first embodiment and a duplicated description ofsuch places is omitted. The third embodiment below also describes aprocedure when executing the setting operation and pre-read operation ona plurality of selected memory cells MC.

[Operations in Present Embodiment]

FIG. 15 is one example of a flowchart describing a procedure whenperforming a pre-read operation and a setting operation in the presentembodiment. FIG. 16 is one example of a view showing a selected memorycell during the setting operation in the present embodiment.

As shown in FIG. 16, the setting operation in the present embodiment isexecuted on the memory cells MC01_1, MC11_1, and MC21_1 connected to theselected word line WL01. At this time, the pre-read operation isexecuted on the bit lines BL10, BL11, and BL12 prior to the settingoperation on the selected memory cells MC01_1, MC11_1, and MC21_1.Description proceeds below with reference to the flowchart of FIG. 15.

When operation of the semiconductor memory device in the presentembodiment is started, in step S21, the pre-read operation on each ofthe bit lines BL10, BL11, and BL12 is respectively executed. Thispre-read operation is an operation that performs the pre-read operationin the first embodiment described using FIG. 11, a plurality of times,changing the selected bit line BL. A value of the voltage of each of thebit lines BL10, BL11, and BL12 read by this pre-read operation is, forexample, retained in the buffer circuit 17 in the control circuit. Thevalue of the reference voltage VREF during the setting operation is setfor each of the bit lines BL10, BL11, and BL12 based on the value of thevoltage of each of the bit lines BL10, BL11, and BL12 in this pre-readoperation.

Next, in step S22, the setting operation on the selected memory cellMC01_1 is executed. At this time, the voltage Vwl is applied to theselected word line WL01 and the voltage Vbl is applied to the selectedbit line BL10. Due to the voltage Vwl-Vbl, the variable resistanceelement VR in the selected memory cell MC01_1 changes from ahigh-resistance state to a low-resistance state and the voltage of theselected bit line BL10 rises. When it is detected that the voltage ofthe selected bit line BL10 has exceeded the reference voltage VREF, thesetting operation finishes. Now, the reference voltage VREF is set basedon the pre-read operation executed in advance on the bit line BL10.

Thereafter, in step S23, the setting operation on the selected memorycell MC11_1 is executed, and in step S24, the setting operation on theselected memory cell MC21_1 is executed. The reference voltage VREFduring the setting operation on the selected memory cells MC11_1 andMC21_1 is respectively set based on the pre-read operation executed inadvance on each of the bit lines BL11 and BL12.

Note that when executing the setting operation on a plurality of memorycells MC connected to one bit line BL, an identical value of thereference voltage VREF which is set based on the pre-read operationexecuted on that bit line BL, is employed.

[Advantages]

In the setting operation in the present embodiment, the value of thereference voltage VREF is adjusted based on the voltage value of the bitline BL detected during the pre-read operation. By changing thereference voltage VREF in view of the voltage change caused by memorycells MC other than the selected memory cell MC, the voltage change inthe selected bit line BL caused by the change in resistance state of theselected memory cell MC during the setting operation is reliablydetected. Therefore, the semiconductor memory device in the presentembodiment can reliably detect change in the resistance state of theselected memory cell MC.

Moreover, in the procedure of the setting operation and the pre-readoperation in the present embodiment, the pre-read operation is performedin advance on all of the bit lines BL. The reference voltage VREF duringthe setting operation is set for each of the bit lines BL based on thispre-read operation. When executing the setting operation on a pluralityof memory cells MC connected to one bit line BL, the pre-read operationis not executed for each memory cell MC, hence time required for thesetting operation can be reduced.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor memory device, comprising: amemory cell array including a plurality of first lines disposed on asubstrate, a plurality of second lines disposed intersecting the firstlines, and memory cells disposed at each of intersections of the firstlines and the second lines and each configured having a currentrectifier element and a variable resistance element connected in seriestherein; and a control circuit configured to apply a first voltage to aselected first line, apply a second voltage having a voltage value whichis smaller than that of the first voltage to a selected second line, andapply a third voltage and a fourth voltage to a non-selected first lineand a non-selected second line in a setting operation, respectively,such that a first potential difference is applied to a selected memorycell disposed at the intersection of the selected first line and theselected second line, the control circuit including a detection circuitconfigured to, during the setting operation, detect a transition of aresistance state of the selected memory cell using a reference voltage,and the control circuit being configured to, before the settingoperation, execute a read operation in which the control circuit appliesthe third voltage to the selected first line and the non-selected firstline, applies the second voltage to the selected second line, andapplies the fourth voltage to the non-selected second line, and set thereference voltage based on a voltage value of the selected second lineduring the read operation.
 2. The semiconductor memory device accordingto claim 1, wherein the control circuit is configured to, when executingthe setting operation on a plurality of the selected memory cells,execute the read operation and the setting operation on each single oneof the selected memory cells.
 3. The semiconductor memory deviceaccording to claim 1, wherein the control circuit is configured to,before the setting operation on a plurality of the selected memorycells, detect voltage values of a plurality of the selected second linesby a plurality of times of the read operation.
 4. The semiconductormemory device according to claim 1, wherein a plurality of the memorycell arrays are stacked in a direction perpendicular to the substrate.5. The semiconductor memory device according to claim 1, wherein thevariable resistance element changes from a high-resistance state to alow-resistance state by the first potential difference.
 6. Thesemiconductor memory device according to claim 1, wherein the controlcircuit applies the first potential difference in an opposite directionto a current rectifying direction of the current rectifier element. 7.The semiconductor memory device according to claim 1, wherein the thirdvoltage and the fourth voltage are an identical voltage.
 8. Asemiconductor memory device, comprising: a memory cell array including aplurality of first lines disposed on a substrate, a plurality of secondlines disposed intersecting the first lines, and memory cells disposedat each of intersections of the first lines and the second lines andeach configured having a current rectifier element and a variableresistance element connected in series therein; and a control circuitconfigured to apply a first voltage to a selected first line, apply asecond voltage having a voltage value which is smaller than that of thefirst voltage to a selected second line, and apply a third voltage and afourth voltage to a non-selected first line and a non-selected secondline in a setting operation, respectively, such that a first potentialdifference is applied to a selected memory cell disposed at theintersection of the selected first line and the selected second line,the control circuit including a detection circuit configured to, duringthe setting operation, detect a transition of a resistance state of theselected memory cell using a reference voltage, and the control circuitbeing configured capable of changing the reference voltage.
 9. Thesemiconductor memory device according to claim 8, wherein the controlcircuit is configured to, when executing the setting operation on aplurality of the selected memory cells, change the reference voltage foreach single one of the selected memory cells.
 10. The semiconductormemory device according to claim 8, wherein the control circuit isconfigured to, when executing the setting operation on a plurality ofthe selected memory cells, set the reference voltage for each of theselected second lines to which the selected memory cells are connected.11. The semiconductor memory device according to claim 8, wherein aplurality of the memory cell arrays are stacked in a directionperpendicular to the substrate.
 12. The semiconductor memory deviceaccording to claim 8, wherein the variable resistance element changesfrom a high-resistance state to a low-resistance state by the firstpotential difference.
 13. The semiconductor memory device according toclaim 8, wherein the control circuit applies the first potentialdifference in an opposite direction to a current rectifying direction ofthe current rectifier element.
 14. The semiconductor memory deviceaccording to claim 8, wherein the third voltage and the fourth voltageare an identical voltage.
 15. A method of operating a semiconductormemory device, the semiconductor memory device comprising a memory cellarray including a plurality of first lines disposed on a substrate, aplurality of second lines disposed intersecting the first lines, andmemory cells disposed at each of intersections of the first lines andthe second lines and each configured having a current rectifier elementand a variable resistance element connected in series therein, and thesemiconductor memory device configured to execute a setting operation inwhich a first voltage is applied to a selected first line, a secondvoltage having a voltage value which is smaller than that of the firstvoltage is applied to a selected second line, and a third voltage and afourth voltage are applied to a non-selected first line and anon-selected second line, respectively, such that a first potentialdifference is applied to a selected memory cell disposed at theintersection of the selected first line and the selected second line,the method comprising: before the setting operation, executing a readoperation in which the third voltage is applied to the selected firstline and the non-selected first line, the second voltage is applied tothe selected second line, and the fourth voltage is applied to thenon-selected second line, and setting a reference voltage based on avoltage value of the selected second line during the read operation; andduring the setting operation, detecting a transition of a resistancestate of the selected memory cell using the reference voltage.
 16. Themethod of operating a semiconductor memory device according to claim 15,wherein when the setting operation is executed on a plurality of theselected memory cells, the read operation and the setting operation areexecuted on each single one of the selected memory cells.
 17. The methodof operating a semiconductor memory device according to claim 15,wherein before the setting operation on a plurality of the selectedmemory cells, voltage values of a plurality of the selected second linesare detected by a plurality of times of the read operation.
 18. Themethod of operating a semiconductor memory device according to claim 15,wherein the variable resistance element changes from a high-resistancestate to a low-resistance state by the first potential difference. 19.The method of operating a semiconductor memory device according to claim15, wherein the first potential difference is applied in an oppositedirection to a current rectifying direction of the current rectifierelement.
 20. The method of operating a semiconductor memory deviceaccording to claim 15, wherein the third voltage and the fourth voltageare an identical voltage.